Flooring Adhesives - SikaBond®-T25

Trowel-applied, polyurethane, Wood Flooring Adhesive

SikaBond®-T25 is a one-component, low-VOC, low odor, moisture cured polyurethane adhesive for full surface bonding of wood flooring. SikaBond®-T25 will tenaciously bond wood to most surfaces, including concrete, plywood, and leveling and patch underlayments that have been properly prepared.

• 125% Elongation
• Bonds up to 3/4" solid and engineered wood
• Low odor
• Easy to trowel
• Excellent workability
• Fast curing
• Crack bridging
• Suitable for common types of wood floors
• Suitable for in-floor radiant heat installation
• Contains no water
• Tenacious bond

Usage

SikaBond®-T25 may be used to bond all engineered, solid plank flat milled,solid shorts, bamboo, cork and parquet hardwood flooring designed by the manufacturer for glue down applications. This adhesive can also be used for many other bonding applications that are common for light commercial and residential applications including acoustic rubber underlayment systems.

Advantages

• 125% Elongation
• Bonds up to 3/4" solid and engineered wood
• Low odor
• Easy to trowel
• Excellent workability
• Fast curing
• Crack bridging
• Suitable for common types of wood floors
• Suitable for in-floor radiant heat installation
• Contains no water
• Tenacious bond

Packaging

5 gal. (18.93 L) unit

Color

Tan

Product Details

Product Information

Chemical Base

1-component polyurethane, moisture curing

Shelf Life

12 months from date of production

Storage Conditions

Store in dry conditions and protected from direct sunlight at temperatures between 50°F and 77°F (10°C and 25°C).

Density

9.85 lbs/gal (1.18 kg/L)

Technical Information

Shore A Hardness

~ 50 (after 28 days)

Tensile Strength

150 psi at 73°F (23°C) and 50% RH

Shear Strength

150 psi using 1 mm adhesive thickness at 73°F (23°C) and 50% RH

Service Temperature

-40°F to +158°F

Application

Application Information

Sag Flow

Consistency: Spreads easily, holds ridges after troweling

Ambient Air Temperature

Room temperature between 60°F (15°C) and 90°F (35°C). For ambient temperatures the standard construction rules are relevant. Follow all wood floor manufacturer’s acclimation and room temperature requirements.

Relative Air Humidity

Between 40% and 70% during installation is best for adhesive. See wood floor manufacturer for wood requirements.

Substrate Temperature

During laying and until SikaBond®-T25 has fully cured, substrate temperature should be greater than 60°F (15°C) and in case of radiant heating, less than 70°F (20°C). For substrate temperatures, the standard construction rules are relevant.

Substrate Moisture Content

For use as an adhesive only: SikaBond^® T-25 is not affected by moisture or vapor transmission. For protection of the wood, follow the wood floor manufacturer’s requirements for subfloor moisture. If substrate is not acceptable, use SikaBond® T-25 at recommended coverage rate as All-in-One or Sika® MB. See Technical Data Sheet for proper instruction.

For use as an adhesive and moisture membrane: Concrete moisture vapor emission rate (MVER) may not exceed 12 lbs. per 1,000 sq.ft. (5,44 kg per 92,9 m²) per 24 hours, anhydrous calcium chloride test (ASTM F1869). Do not install when the relative humidity (RH) of the concrete slab exceeds 87% (ASTM F2170).

Curing Rate

Floor may accept light foot traffic after:

• at 45-50 SF/gal (P5 trowel): after 6-8 h
• at 30-35 SF/gal (SC+MB trowel): after 12 h

(depending on climatic conditions and adhesive layer thickness)

Floor can be sanded after 18 hours

Skin Time / Laying Time

~ 45-60 minutes at 73°F (23°C) and 50% RH

Consumption

Coverage

• Coverage must be monitored to ensure accuracy of application. Trowel angle may prevent proper coverage.
• Applicator is responsible for periodic inspection of the trowel to check for excessive wear. Worn trowels must be replaced immediately.
• In case of uneven substrates, it may be necessary to use a notched trowel with bigger notches (avert hollow sections).
• Coverage must be monitored to ensure accuracy of application. Trowel angle may prevent proper coverage.
• Trowel size is recommended to obtain proper coverage larger sizes are acceptable. Excessive amounts of adhesive may cause wood flooring to slide while placing check coverage during installation.
• P5 trowels should be used at 90° angle, SC+MB trowel or 1/4 in. (6.3 mm) x 1/4 in. (6.3 mm) V-notch at 45° angle to subfloor to get stated coverages.
• Substrate Quality: Structurally sound, clean, dry, homogeneous, even, free from grease, dust and loose particles, paint, laitance, and other poorly adhering particles must be removed.
• The P5 and SC+MB trowel are available from Sika.

Application Steps

APPLICATION INSTRUCTIONS

Substrate Quality
Substrate must be clean and dry, homogeneous, even, free from grease, dust and loose particles. Paint, laitance and other poorly adhering particles must be removed by mechanical means.

SUBSTRATE PREPARATION

SikaBond® can be used on properly prepared, structurally sound concrete, cementitious patch/underlayments, chipboards, ceramic tiles, plywood. For on-grade sub-floors Sika® recommends the use of Sika® MB for best protection against subfloor moisture - moisture testing is required by the wood flooring manufacturer for best results with the wood flooring products. Below grade applications are generally not recommended unless proper precautions are taken to protect the wood flooring from sub-floor and in-room humidity extremes. Sika® recommends the use of Sika® MB over any dry, gypsum-based sub-flooring to enhance surface strength. Preparation is a critical step in the installation process and will ensure a successful long term tenacious bond. All concrete, cement screed and gypsum-based subfloors must be structurally sound, clean, dry, smooth; free of voids, projections, loose materials, oil, grease, sealers and other surface contaminants Thoroughly clean with an industrial vacuum. Remove laitance or weak areas mechanically and thoroughly. For application over ceramic tiles, it is necessary to grind tile surfaces and clean thoroughly with an industrial vacuum. For substrates with old well-bonded adhesive or adhesive residue use Sika® MB - see Sika® MB data sheet for installation instructions and proper details. If the surface contains asphalt (cutback) adhesive follow the Resilient Floor Covering Institute “Recommended Work Practices” for removal. When the asphalt (cutback) adhesive is sufficiently removed use Sika® MB to help promote adhesion to the subfloor - or use an industry approved leveling compound over the cutback residue. SikaBond®-T25 will adhere to the most common patching/leveling compounds. Due to differences in asphalt-based adhesive types and performance capabilities; the applicator must verify that the preparation of the surface is sufficient prior to using Sika® MB or patch/level compound. Due to differences in asphalt-based adhesive types and performance capabilities, applicators must verify that preparation of the surface is sufficient prior to using Sika® MB or patch/ level compound. For unknown substrates.

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