Citadel Architectural Products, Inc. -Dry-Joint ACM / MCM - Envelope 2000® RainScreen (RS)

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Ultimate Performance in a Dry-Joint System


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Citadel Architectural Products, Inc.
6198 W Airport Blvd
Greenfield, IN 46140
Tel: (800) 446-8828

info@citadelap.com

https://www.citadelap.com/

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Overview


Dry-Joint ACM / MCM - Envelope 2000® RainScreen (RS)

The standard phenolic core meets (or exceeds) fire resistant code requirements.

Panel Thickness

A durable, .105″ thermoset phenolic resin core provides an ultra-smooth substrate.

System Depth

The system measures 1-7/8″ from the face of the substrate to the face of the moldings.

Panel Weight

This panel has a nominal weight of approximately 1.25 lbs per square foot.

Cavity Wall

This system allows incidental moisture to enter the system but then exit through weepholes.

Fire Resistant

The standard phenolic core meets (or exceeds) fire resistant code requirements.

Code Tested

Designed for performance, tested by ASTM 283, 330 and 331 as well as ICC and NFPA 285.


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Specifications

Panel

Standard Joint

Variable Joint

Composition

  • .024″ Smooth Aluminum
  • .105″ Thermoset Phenolic Resin
  • .010″ Primed Aluminum

Standard Sizes

  • 48″ x 96″ (121.9cm x 243.8cm)
  • 48″ x 120″ (121.9cm x 304.8cm)
  • 48″ x 144″ (121.9cm x 365.8cm)
  • 60″ x 96″ (152.4cm x 243.8cm)
  • 60″ x 120″ (152.4cm x 304.8cm)
  • 60″ x 144″ (152.4cm x 365.8cm)

System Moldings

  • RR-103 Panel Clip
  • 8212 Starter Extrusion
  • 8214 Hanger Extrusion
  • 8216 Panel Extrusion