Sika Corporation -Flooring Adhesives - SikaBond®-T100

DOWNLOADS

All-in-One Hybrid urethane adhesive, moisture vapor and sound reduction membrane


Category: 096000 | above-grade vapor barriers | concrete floor vapor barriers...

MasterFormat: Common Work Results for Wood, Plastics, and Composites | Adhesives* | Vapor Retarders...


Related Products

Overview


Flooring Adhesives - SikaBond®-T100

All-in-One Hybrid urethane adhesive, moisture vapor and sound reduction membrane

SikaBond®-T100 is a one component, zero VOC, permanently elastic, super strong, very low permeability, moisture-cure, all-in-one hybrid polyurethane adhesive that offers unlimited moisture protection, crack bridging and sound reduction for full surface wood floor bonding.

  • 150% Elongation
  • Bonds up to 3/4" solid and engineered wood
  • Cleans off prefinished floors before and after cure
  • Unlimited subfloor moisture vapor protection
  • No moisture testing required - a dry to touch substrate is the only requirement
  • ZERO VOC
  • Contains no water, solvent or isocyanates
  • Low moisture vapor permeability
  • Sound protection - meets local IIC and STC requirements
  • Crack Bridging
  • Very easy to spread
  • Low odor
  • Advanced Hybrid Technology
  • Excellent green grab
  • High elongation
  • Permanently elastic - allows planks to expand and contract without damage to the adhesive
  • Tenacious Bonding
  • Passes USGBC LEED Version 4

Usage

SikaBond®-T100 may be used for solid and engineered wood floors (strips, longstrips, planks, panels, boards), mosaic parquet, industrial parquet, wood paving (residential) as well as chip boards and plywood. Once cured, SikaBond®-T100 will generate a super strong bond to a variety of substrates for glue down installations and at the same time form a membrane which reduces moisture vapor transmission from the subfloor and sound reduction membrane.

Advantages

  • 150% Elongation
  • Bonds up to 3/4" solid and engineered wood
  • Cleans off prefinished floors before and after cure
  • Unlimited subfloor moisture vapor protection
  • No moisture testing required - a dry to touch substrate is the only requirement
  • ZERO VOC
  • Contains no water, solvent or isocyanates
  • Low moisture vapor permeability
  • Sound protection - meets local IIC and STC requirements
  • Crack Bridging
  • Very easy to spread
  • Low odor
  • Advanced Hybrid Technology
  • Excellent green grab
  • High elongation
  • Permanently elastic - allows planks to expand and contract without damage to the adhesive
  • Tenacious Bonding
  • Passes USGBC LEED Version 4

Packaging

4 gal. (15.14 L)

Color

Off - white

Product Details

APPROVALS / STANDARDS
  • Independently tested to - STC 62 (ASTM E-90) when used as a sound control membrane at the specified coverage.
  • Independently tested to IIC = 67 (ASTM E-492) when used as a sound control membrane at the specified coverage.
  • Carpet and Rug Institute (CRI) Green Label PLUS Certified

Product Information

Chemical Base

Hybrid Polymer

Shelf Life

12 months from date of production if stored in undamaged original sealed containers

Storage Conditions

Keep in dry conditions and protected from direct sunlight at temperatures between 50 °F and 77 °F (10-25 °C)

Density

1.64 kg/L

Water Vapor Permeability is < 4 g/mmHg, 24h, m2 according to ASTM E-96 (< 4 Perms)

Consistency

Easy to spread

Technical Information

Service Temperature

-40-150 °F (-40-65 °C)

Application

Application Information

Ambient Air Temperature

Room temperature between 50 °F (15 °C) and 90 °F (35 °C). For ambient temperatures standard construction guidelines should be followed. Follow all wood floor manufacturers’ acclimation and room temperature requirements.

Relative Air Humidity

Between 40 % and 70 % during installation is best for adhesive. See wood floor manufacturer for wood requirements.

Substrate Temperature

During laying and until SikaBond®-T100 has fully cured, substrate temperature should be greater than 60 °F (15 °C) and in the case of radiant floor heating, less than 70 °F (20 °C). For substrate temperatures, standard construction guidelines should be followed.

Substrate Moisture Content

For use as an adhesive only: SikaBond®-T100 is not affected by moisture or vapor transmission. For protection of the wood, follow the wood floor manufacturer’s requirements for subfloor moisture. If substrate is not acceptable per wood manufacturer’s requirements, use SikaBond®-T100 at recommended coverage rate for moisture protection or use Sika® MB.

For use as an adhesive and membrane: Concrete must be dry to touch. Inspect for any wetness at base of drywall or visible signs of moisture on concrete. Concrete and cement-based underlayments must be fully cured and free of any hydrostatic and/or moisture problems. When properly applied in accordance with Sika® guidelines, SikaBond®-T100 provides unlimited moisture vapor protection.

Curing Rate

Floor may accept light foot traffic after: 8 hours

Floor can be sanded after 18 hours.

Consumption

Coverage
  • Coverage must be monitored to ensure accuracy of application. Trowel angle may prevent proper coverage.
  • Applicator is responsible for periodic inspection of the trowel to check for excessive wear. Worn trowels must be replaced immediately.
  • In case of uneven substrates, it may be necessary to use a notched trowel with bigger notches (avert hollow sections).
  • Coverage must be monitored to ensure accuracy of application. Trowel angle may prevent proper coverage.
  • Trowel size is recommended to obtain proper coverage larger sizes are acceptable. Excessive amounts of adhesive may cause wood flooring to slide while placing check coverage during installation.
  • P5 trowels should be used at 90° angle, SC+MB trowel or 1/4 in. (6.3 mm) x 1/4 in. (6.3 mm) V-notch at 45° angle to subfloor to get stated coverages.
  • Substrate Quality: Structurally sound, clean, dry, homogeneous, even, free from grease, dust and loose particles, paint, laitance, and other poorly adhering particles must be removed.
  • The P5 and SC+MB trowel are available from Sika.

Application Steps

SUBSTRATE PREPARATION

SikaBond®-T100 can be used without priming on properly prepared, structurally sound concrete, cement floors, chipboards, ceramic tiles, plywood and hardwood. Sika® recommends the use of Sika® MB over any dry, gypsum based subflooring to enhance surface strength. Maximum acceptable floor variation is 3/16 in. (4.7 mm) over 10 feet (3 m). Preparation is a critical step in the installation process and will ensure a successful long term tenacious bond. All concrete, cement screed and gypsum based subfloors must be structurally sound, clean, dry, smooth, free of voids, projections, loose materials, oil, grease, sealers and other surface contaminants. Remove laitance or weak areas mechanically. For application over ceramic tiles it is necessary to grind tile surfaces and clean thoroughly with an industrial vacuum. For substrates with old well bonded adhesive or adhesive residue use Sika® MB - see Product Data Sheet for installation instructions and proper details. If surface contains asphalt (cutback) adhesive follow the Resilient Floor Covering Institute “Recommended Work Practices” for removal. When the asphalt (cutback) adhesive is sufficiently removed use Sika® MB to help promote adhesion to the subfloor or use a Sika Level system over the cutback residue. SikaBond®-T100 will adhere to Sika® Level levelers and patches as well as most common patching/leveling compounds.


See More


Specifications

ENVIRONMENTAL INFORMATION

LEED EQc 4.1

( 100 g/L limit )

SCAQMD, Rule 1168

( 100 g/L limit )

passes

passes

BAAQMD, Reg. 8, Rule 51

( 120 g/L limit )

LEED v4

( < 0.5 mg/m3 )

passes

passes

Shear Strength

2.0 N/mm², 1 mm adhesive thickness

(74 °F (24 °C) and 50 % R.H.)

Shore A Hardness

45-50

(7 days at 74 °F (24 °C) and 50 % R.H.)

Skin Time / Laying Time
45 min

74 °F 50 % R.H.

Tensile Strength

150 psi (1.03 MPa)

(7 days at 74 °F (24 °C) and 50 % R.H.)

Coverage