Flooring Adhesives - SikaBond®-T55

Trowel Grade Polyurethane Elastic Adhesive for Wood Flooring.

SikaBond®-T55 is a one-component, low-VOC, permanently elastic, crack bridging, super strong polyurethane adhesive for full surface bonding of wood flooring.

• 400 % Elongation
• Bonds up to 3/4" solid and engineered wood
• Low-odor
• Easy to trowel formulation
• Fast curing - unfinished wood flooring can be sanded after 12 hours of cure time

• Crack bridging
• Suitable for most common types of wood floors
• Especially good for problematic woods such as beech and bamboo
• Suitable for bonding wood floors directly onto old ceramic tiles
• Suitable for in-floor radiant heat installation
• Footfall-sound-dampening adhesive
• Contains no water
• Eliminate sleepers and plywood over concrete and gypsum substrates
• Permanently elastic - allows planks to expand and contract without damage to the adhesive or substrate

Usage

SikaBond®-T55 may be used to bond solid and engineered wood floors (strips, longstrips, planks, panels, boards), mosaic parquet, industrial parquet, wood paving (residential) and chip boards to concrete, mortar, and old existing tiles.

Advantages

• 400 % Elongation
• Bonds up to 3/4" solid and engineered wood
• Low-odor
• Easy to trowel formulation
• Fast curing - unfinished wood flooring can be sanded after 12 hours of cure time

• Crack bridging
• Suitable for most common types of wood floors
• Especially good for problematic woods such as beech and bamboo
• Suitable for bonding wood floors directly onto old ceramic tiles
• Suitable for in-floor radiant heat installation
• Footfall-sound-dampening adhesive
• Contains no water
• Eliminate sleepers and plywood over concrete and gypsum substrates
• Permanently elastic - allows planks to expand and contract without damage to the adhesive or substrate

Packaging

5 gal. (18.93 L) unit

Color

Tan

Product Details

Product Information

Chemical Base

1-component Polyurethane, moisture curing

Shelf Life

12 months from date of production if stored in undamaged, unopened, original sealed containers.

Storage Conditions

Store in dry conditions and protected from direct sunlight at temperatures between 50 °F and 77 °F (10 °C and 25 °C).

Technical Information

Service Temperature

-40 °F (-40 °C) to 158 °F (70 °C)

Application

Application Information

Sag Flow

Consistency: Spreads very easily, holds ridges after troweling.

Ambient Air Temperature

Room temperature between 60 °F (15 °C) and 90 °F (35 °C). For ambient temperatures the standard construction rules are relevant. Follow all wood floor manufacturer’s acclimation and room temperature requirements.

Relative Air Humidity

Between 40 % and 70 %

Substrate Temperature

During laying and until SikaBond®-T55 has fully cured, substrate temperature should be greater than 60 °F (15 °C) and in case of floor heating, less than 70 °F (20 °C). For substrate temperatures, the standard construction rules are relevant

Substrate Moisture Content

Moisture requirements are set forth to protect the wood flooring products that can expand and contract with different moisture levels. SikaBond®-T55 is not affected by moisture or vapor transmission. The guidelines below are included to provide the best practices in moisture vapor testing that exists today. Permissible substrate moisture contents are listed on the chart below.

The National Wood Flooring Association recommends the use of moisture testing devices that identify actual moisture content in percentages (%). For best results in measuring the moisture levels in cement based subfloor use the Tramex measuring device to find the highest reading in the application area and then run the CM method at that highest point to determine the worst case. As a general guideline for floors with no in-floor heating if the Tramex is below 4 % the Sika® MB will not be necessary and between 4 % and 6 % Sika® MB will be required - however, the CM method must be used to make final determination of concrete moisture levels - use chart above. For moisture content and quality of substrates the guidelines of wood floor manufacturer must be observed.

Curing Rate

4.0 mm/24h at 73 °F(23 °C) and 50 % RH.

Floor may accept light foot traffic after 4 hrs. and sanded 12 hrs. after installation (depending on climatic conditions and adhesive layer thickness).

Skin Time / Laying Time

~ 45-60 minutes at 73 °F(23 °C) and 50 % RH

Consumption

Coverage

• Coverage must be monitored to ensure accuracy of application. Trowel angle may prevent proper coverage.
• Applicator is responsible for periodic inspection of the trowel to check for excessive wear. Worn trowels must be replaced immediately.
• In case of uneven substrates, it may be necessary to use a notched trowel with bigger notches (avert hollow sections).
• Coverage must be monitored to ensure accuracy of application. Trowel angle may prevent proper coverage.
• Trowel size is recommended to obtain proper coverage larger sizes are acceptable. Excessive amounts of adhesive may cause wood flooring to slide while placing check coverage during installation.
• P5 trowels should be used at 90° angle
• Substrate Quality: Structurally sound, clean, dry, homogeneous, even, free from grease, dust and loose particles, paint, laitance, and other poorly adhering particles must be removed.
• The P5 trowel available from Sika.

Application Steps

SUBSTRATE PREPARATION

SikaBond®-T55 can generally be used without priming on properly prepared, structurally sound concrete, cement floors, chipboards, ceramic tiles, plywood and hardwood. For on-grade subfloors Sika® recommends the use of Sika® MB for best protection against sub-floor moisture.
Moisture testing is required by the wood flooring manufacturer for best results with the wood flooring products. Below grade applications are generally not recommended unless proper precautions are taken to protect the wood flooring from sub-floor and in-room humidity extremes.
Sika recommends the use of Sika® MB over any dry, gypsum based sub-flooring to enhance surface strength.

Preparation is a critical step in the installation process and will ensure a successful long term tenacious bond. All concrete, cement screed and gypsum based subfloors must be structurally sound, clean, dry, smooth, free of voids, projections, loose materials, oil, grease, sealers and other surface contaminants. Remove laitance or weak areas mechanically. For application over ceramic tiles it is necessary to grind tile surfaces and clean thoroughly with an industrial vacuum. For substrates with old well bonded adhesive or adhesive residue use Sika® MB - see Sika® MB data sheet for installation instructions and proper details.

If the surface contains asphalt (cutback) adhesive follow the Resilient Floor Covering Institute “Recommended Work Practices” for removal. When the asphalt (cutback) adhesive is sufficiently removed use the Sika® MB to help promote adhesion to the subfloor - or use an industry approved levelling compound over the cutback residue. SikaBond®-T55 will adhere to most common patching/levelling compounds. Due to differences in asphalt based adhesive types and performance capabilities; applicator must verify that preparation of the surface is sufficient prior to using Sika® MB or patch/level compound.

CLEANING OF TOOLS

Clean all tools and application equipment immediately after use with Sika® Remover-208. Once cured, resi-
dual material can only be removed mechanically.

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