Flooring Adhesives - SikaBond® T-53

SikaBond-T53 is a one-part polyurethane adhesive for timber flooring systems. The adhesive is of high viscosity and cures on exposure to atmospheric moisture.

SikaBond® T-53 is a 1-component, wood flooring adhesive with high viscosity.

• Adhesive can be sanded
• Floor can be walked on / sanded 12 / 24 hours
• Elastic, footfall-sound dampening properties
• Reduces stress transfer between the wood floor and the substrate
• Suitable for common types of wood floors

Usage

SikaBond® T-53 is designed for use with the Sika® AcouBond®-System and beaded application of solid wood boards (tongued and grooved), 3-ply engineered wood and chipboard floor systems and subfloors.

Advantages

• Adhesive can be sanded
• Floor can be walked on / sanded 12 / 24 hours
• Elastic, footfall-sound dampening properties
• Reduces stress transfer between the wood floor and the substrate
• Suitable for common types of wood floors

Packaging

600 ml foil pack, 20 foil packs per box

Color

Beige

Product Details

Product Information

Chemical Base

Polyurethane

Shelf Life

SikaBond® T-53 has a shelf life of 12 months from the date of production, if it is stored properly in undamaged, original, sealed packaging, and if the storage conditions are met.

Storage Conditions

SikaBond® T-53 shall be stored in dry conditions, protected from direct sunlight and at temperatures between +5 °C and +25 °C.

Technical Information

Service Temperature

+5 °C to +40 °C

Application

Application Information

Sag Flow

SikaBond® T-53 maintains stable trowel marks.
SikaBond® T-53 is easily applied using guns or SikaBond® Dispensers.

Ambient Air Temperature

+15 °C to +35 °C

Relative Air Humidity

40% to 70%

Substrate Temperature

During laying and until SikaBond® T-53 has fully cured, the substrate and ambient temperatures shall be between +15 °C and +35 °C without and between +20 °C and +35 °C with underfloor heating

Substrate Moisture Content

Permissible substrate moisture content without underfloor heating:

• 2.5% CM for cement screeds.
• 0.5% CM for anhydrite screeds.
• 3-12% CM for magnetite flooring (depending on the organic content).

Permissible substrate moisture content for use with underfloor heating:

• 1.8% CM for cement screeds.
• 0.3% CM for anhydrite screeds.
• 3-12% CM for magnetite flooring (depending on the organic content).

Note: For all moisture contents, the quality of the substrates and surfaces, always follow the guidelines of the wood flooring manufacturer.

Curing Rate

3.0 mm/24 hours approx. (23 °C / 50% r.h.)

Skin Time / Laying Time

60 minutes approx. (23 °C / 50% r.h.)

Consumption

Coverage

Sika^® AcouBond^®-System:

• 500-600 ml/m² approx. for SikaLayer^®-03 and 500-600 ml/m² approx. for SikaLayer^®-05. All cut-outs must be filled out. Use a triangular nozzle with a 8 x 10 mm opening.

Full Surface Bonding:

• 700−900 g/m² with notched trowel B3 (TKB Germany) e.g. for lam parquet, mosaic parquet and industrial parquet.
• 800−1000 g/m² with notched trowel B11 (TKB Germany) or P5 (US Standard) e.g. solid wood, engineered long-strips and panels, industrial parquet, other residential wood floors and paving, and chipboard.

Beaded Application:

• 44 ml approx. per running meter consumes 200-400 g/m², depending on bead spacing (solid wood boards, 3-ply engineered wood, chipboards).

For bonding long or wide boards, or when working on uneven substrates, it may be necessary to use a notched trowel with bigger notches to ensure that a sufficient amount of SikaBond® T-53 is applied to provide a uniform adhesive surface and prevent hollow sections i.e. without full surface bond.
For substrates primed with Sika^® Primer MR Fast or Sika^® Primer MB, the consumption of SikaBond® T-53 may be reduced.

Application Steps

APPLICATION INSTRUCTIONS

For the application of SikaBond® T-53 all standard construction guidelines apply.
For further information, please refer to the Method Statement "Full Surface Bonding".

SUBSTRATE PREPARATION

• The substrate must be clean, dry, sound and homogeneous, free from oils, grease, dust and loose or friable particles. Paint, cement laitance and other poorly adhering contaminants must be removed.
• Concrete and/or cement screeds must be ground and thoroughly cleaned with an industrial vacuum.
• Anhydrite screeds, including flowable anhydrite screeds must be ground and thoroughly cleaned with an industrial vacuum shortly before bonding with the adhesive starts.
• Broadcast mastic asphalt must be primed with Sika^® Primer MR Fast or Sika^® Primer MB. For the instructions for use, please refer to the corresponding Product Data Sheet.
• Glazed ceramic and old existing ceramic tiles must be degreased and cleaned with Sika^® Aktivator-205, or the tile surfaces must be ground and then thoroughly cleaned with an industrial vacuum.
• Wood and/or gypsum boards (e.g. chipboard, plywood) must be glued and/or screwed to the substructure in order to be fixed to the substrate. For floating dry-floors, contact our Technical Service Department.
• For other substrates contact our Technical Service Department for advice and assistance.
• SikaBond® T-53 can be used without priming on cement based floors, anhydrite floors, chipboards, concrete and ceramic tiles.
• For broadcasted mastic asphalt, cement based floors with excessive moisture content and use over old adhesive residues or on weak substrates use Sika^® Primer MB. For detailed instructions contact our Technical Service Department.

CLEANING OF TOOLS

Clean all tools and application equipment immediately after use with Sika® Remover-208 and/or Sika® TopClean T. Once cured, residual material can only be removed mechanically.

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