Sika Corporation -Flooring Adhesives - Sika® AcouBond® System

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Elastic Bonding and Acoustical Dampening for Wood Floors

The Sika® AcouBond® System incorporates Direct Bond Technology with acoustic performance.


Category: 096000 | underlayment mats | wood floor underlayment...

MasterFormat: Common Work Results for Wood, Plastics, and Composites | Adhesives* | Flooring...


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Overview


Flooring Adhesives - Sika® AcouBond® System

Elastic Bonding and Acoustical Dampening for Wood Floors

The Sika® AcouBond® System incorporates Direct Bond Technology with acoustic performance. The Sika® AcouBond® System consists of SikaLayer®-03, a 1/8” (3 mm) proprietary specially slotted foam mat, and the SikaBond®-T53, unique permanently elastic, super strong, sound dampening adhesive that forms a tenacious bond to wood flooring, plywood subfloors, concrete, and other common subfloor materials

  • SikaLayer®-03: Dimensionally stable and pressure-resistant. Defined amount of adhesive consumption. Low weight for transport.
  • SikaBond®-T53: 1 component, highly flexible ready-to-use polyurethane adhesive
  • No limitations on maximum wood length. Bonds unlimited width solid and engineered planks directly to concrete substrates.
  • 500% Elongation
  • Fast curing for early green strength and superior holding power
  • Extremely easy to install
  • Independently tested to - IIC 59 and STC 60
  • Independently tested to - FIIC 59 and FSTC 59
  • Structurally bonds wood flooring to the subfloor
  • Eliminates the extensive labor of installing cork underlayments
  • No need for sleepers and plywood over concrete- and gypsum-based subfloors
  • Innovative walk-on work method
  • Can reduce overall installation costs up to 30%
  • Suitable for bonding wood floors directly onto old ceramic tiles
  • Reduces stress on the substrate

Usage

The Sika® AcouBond® System is used to bond structurally sound solid and engineered hardwood in new construction and renovations in residential, office, and industrial buildings as well as sales and showrooms. It is commonly used over in-floor radiant heating and on grade cement and gypsum-based slabs. Field testing demonstrates unmatched sound reductions. SikaLayer®-03: Specially designed, proprietary Polyethylene foam mat with symmetrically placed cut-outs to insert adhesive to achieve a high sound dampening effect. SikaBond®-T53: Bonds solid wood flooring up to 8” (18 cm) wide and engineered planks up to 14” (36 cm) wide
directly to concrete substrates. No limitations on maximum wood length.

Advantages

  • SikaLayer®-03: Dimensionally stable and pressure-resistant. Defined amount of adhesive consumption. Low weight for transport.
  • SikaBond®-T53: 1 component, highly flexible ready-to-use polyurethane adhesive
  • No limitations on maximum wood length. Bonds unlimited width solid and engineered planks directly to concrete substrates.
  • 500% Elongation
  • Fast curing for early green strength and superior holding power
  • Extremely easy to install
  • Independently tested to - IIC 59 and STC 60
  • Independently tested to - FIIC 59 and FSTC 59
  • Structurally bonds wood flooring to the subfloor
  • Eliminates the extensive labor of installing cork underlayments
  • No need for sleepers and plywood over concrete- and gypsum-based subfloors
  • Innovative walk-on work method
  • Can reduce overall installation costs up to 30%
  • Suitable for bonding wood floors directly onto old ceramic tiles
  • Reduces stress on the substrate

Packaging

Approximately 13.4 ft2 per sausage (1 box of 20 sausages cover 269 ft2). All cut-outs must be filled. Use application tip with triangular cut out to a 0.32 x 0.4 inch (8 x 10 mm) opening. Tips are included in the shipping carton. Tips can be reused. Do not discard. Allow adhesive residue to cure in the tip min. 24 hours and then remove.

System Details

Sustainability / Certifications / Approvals

ENVIRONMENTAL INFORMATION
  • LEED® EQc 4.1 (100 g/L limit) - Passes
  • SCAQMD, Rule 1168 (100 g/L limit) - Passes
  • BAAQMD, Reg. 8, Rule 51 (120 g/L limit) - Passes
APPROVALS / STANDARDS

Sika® AcouBond®-System with SikaLayer®-03:

  • Independently tested to - IIC 59 (ASTM E 492) and STC 60 (ASTM E 90)(6 “ concrete slab, 5/8 “ suspended gypsum ceiling)
  • Independently field tested to - FIIC 59 (ASTM E 1007) and FSTC 59 (ASTM E 336)(8 “ concrete slab, no suspended ceilings)
  • Reduction of Impact Sound Δ IIC = 24 (ASTM E 2179)

System Information

Storage Conditions

Temperatures between +50°F and +77°F (+10°C and +25°C). Store cool and dry. Protect against direct sunlight and frost.

Application

Application Steps


SUBSTRATE QUALITY

Clean and dry, homogeneous, even, free from grease, dust and loose particles. Paint, laitance and other poorly adhering particles must be removed by mechanical means.

Substrate Temperature

During laying and until SikaBond®-T53 has fully cured substrate temperature should be greater than 60°F (15°C) and in case of floor heating, less than 70°F (20°C).

Air Temperature

Room temperature between 60°F (15°C) and 90°F (35°C). For ambient temperatures the standard construction rules are relevant. Follow all wood floor manufacturer’s acclimation and room temperature requirements.

Substrate Humidity

Moisture requirements are set forth to protect the wood flooring products that can expand and contract with different moisture levels. The Sika® Acoubond® System is not affected by moisture or vapor transmission. The guidelines below are included to provide the best practices in moisture vapor testing that exists today. Permissible substrate moisture contents are listed on the chart below.

The National Wood Flooring Association recommends the use of moisture testing devices that identify actual moisture content in percentages (%). For best results in measuring the moisture levels in cement based subfloor use the Tramex measuring device to find the highest reading in the application area and then run the CM method at that highest point to determine the worst case. As a general guideline for floors with no in-floor heating if the Tramex is below 4 % the Sika® MB will not be necessary and between 4 % and 6 % Sika® MB will be required - however, the CM method must be used to make final determination of concrete moisture levels - use chart above. For moisture content and quality of substrates the guidelines of wood floor manufacturer must be observed.

Substrate Preparation

The Sika® AcouBond® System can generally be used without priming on properly prepared, structurally sound concrete, cement floors, chipboards, ceramic tiles, plywood, and hardwood. Sika recommends the use of Sika® MB over any dry, gypsum-based subflooring to enhance surface strength. The maximum acceptable floor variation is 3/16 in.(4.7 mm) in 10 ft (3 m). Preparation is a critical step in the installation process and will ensure a successful long-term tenacious bond. All concrete, cement screed, and gypsum-based subfloors must be structurally sound, clean, dry, smooth, free of voids, projections, loose materials, oil, grease, sealers and other surface contaminants. Remove laitance or weak areas mechanically. For application over ceramic tiles, it is necessary to grind tile surfaces and clean thoroughly with an industrial vacuum. For substrates with old well-bonded adhesive or adhesive residue use Sika® MB - see Sika® MB data sheet for installation instructions and proper details. If the surface contains asphalt (cutback) adhesive follow the Resilient Floor Covering Institute “Recommended Work Practices” for removal. When the asphalt (cutback) adhesive is sufficiently removed use Sika® MB to help promote adhesion to the subfloor - or use an industry-approved leveling compound over the cutback residue. The Sika® AcouBond® System will adhere to most common patching/ leveling compounds. Due to differences in asphalt-based adhesive types and performance capabilities applicator must verify that preparation of the surface is sufficient prior to using Sika® MB or patch/ level compound.

CLEANING OF TOOLS

All tools must be cleaned immediately after use with SikaBond® Remover or standard industry cleaning solvent. Any adhesive that is permitted to cure on the tool will need to be removed by mechanical means. SikaBond® Remover can be used to remove uncured or cured adhesive and fingerprints from the wood surface.


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Specifications

APPLICATION
Composition

SikaLayer®-03:

Polyethylene Foam
SikaBond®-T53:Polyurethane
Packaging
SikaLayer®-03:Roll54.7 ft. x4.92 ft. = 269 ft2 (25 m2). 12 rolls per pallet

SikaBond®-T53:

Unipacs

20 oz (600 ml) unipacs. 20 unipacs per box

Complete SystemRoll and Unipacs269 ft2 (1 roll of SikaLayer®-03 and 20 SikaBond®-T53 unipacs)
SUBSTRATE QUALITY

Application

Moisture level requirements using Tramex method (%)

Moisture level requirements using CM method (%)

3/4” solid or engineered
over concrete

4%

2.5%

3/4” solid or engineered
over concrete with Sika®
MB layer

6%

4%

3/4” solid or engineered
over in-floor heating
over concrete

3%

1.8%

3/4” solid or engineered
over gypsum based

Tramex should not be used to measure gypsum

0.5%

3/4” solid or engineered
over in-floor heating
over gypsum-based

Tramex should not be used to measure gypsum

0.3%

Shelf Life

SikaLayer®-03

Stored in dry conditions: Unlimited

SikaBond®-T53

In unopened original packaging: 12 months from date of production