Citadel Architectural Products, Inc. -Field-Assembled ACM / MCM - Envelope 2000® Deep-Reveal (DRV)

The Ultimate In Performance In A Hybrid-Type System

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Citadel Architectural Products, Inc.
3131-A North Franklin Rd.
Indianapolis, IN 46226
Tel: (800) 446-8828

Overview

Field-Assembled ACM / MCM - Envelope 2000® Deep-Reveal (DRV)

The Ultimate In Performance In A Hybrid-Type System

Panel Thickness

A durable, .105" thermoset phenolic resin core provides an ultra-smooth substrate.

System Depth

The system measures 1-5/16" from the face of the substrate to the face of the moldings.

Panel Weight

This panel has a nominal weight of approximately 1.25 lbs per square foot.

Cavity Wall

This system allows incidental moisture to enter the system but then exit through weepholes.

Fire Resistant

The standard phenolic core is fire resistant and meets (or exceeds) code requirements.

Code Tested

Designed for performance, tested by ASTM 283, 330 and 331 as well as ICC.

Specifications

Panel	Standard Joint	Variable Joint

Composition .024" Smooth Aluminum .105" Thermoset Phenolic Resin .010" Primed Aluminum	Standard Sizes 48" x 96" (121.9cm x 243.8cm) 48" x 120" (121.9cm x 304.8cm) 48" x 144" (121.9cm x 365.8cm) 60" x 96" (152.4cm x 243.8cm) 60" x 120" (152.4cm x 304.8cm) 60" x 144" (152.4cm x 365.8cm)	System Moldings CR-AX10 Extrusion CR-AX11 Extrusion