Field-Assembled ACM / MCM - Envelope 2000® Deep-Reveal (DRV)
The Ultimate In Performance In A Hybrid-Type System Panel Thickness
A durable, .105" thermoset phenolic resin core provides an ultra-smooth substrate.System Depth
The system measures 1-5/16" from the face of the substrate to the face of the moldings.Panel Weight
This panel has a nominal weight of approximately 1.25 lbs per square foot.Cavity Wall
This system allows incidental moisture to enter the system but then exit through weepholes.Fire Resistant
The standard phenolic core is fire resistant and meets (or exceeds) code requirements.Code Tested
Designed for performance, tested by ASTM 283, 330 and 331 as well as ICC.